o-Phenyl SMC/BMC Molding Resin
Palapreg® P 171-909 is designed for SMC/BMC production processes. It is mainly used in automotive, electrical and building construction products and offers a good price/performance ratio.
Characteristic performance
- Thickening and stabilization
- Better electrical properties
- Better water resistance
- Excellent mobility
typical application
Palapreg® P 171-909 is designed for SMC / BMC production. Palapreg® P 171-909 has good flow properties for common SMC/BMC products and is more suitable for injection molded BMCs and larger sizes and complex structures.
Transportation products: front panels, bumpers and other truck accessories;
Electrical & Electronic: Large size electrical products such as insulated panels, motors, insulators, etc;
Bathroom and building materials: door skins, manned doors, wall panels, sumps, etc;
Special products: water tank panels and products requiring water resistance.
Product Indicators
performances | numerical value | unit (of measure) | Test Methods |
---|---|---|---|
exterior condition | quiet | - | TM 2265 |
Viscosity @23℃ | 1250-1450 | mPa.s | TM 2013 |
Solids content, infrared dried acid value | 62-65 | % | TM 2033 |
acid value | 18-22 | mgKOH/g s | TM 2401 |
Gel time | 115-150 | TM 2261 |
TM2261: 130°C
Reactivity test: 1.0g TXC (Butanox ®) in 100g resin
Typical Properties of Liquid Resins
performances | numerical value | unit (of measure) | Test Methods |
---|---|---|---|
flash point | 33 | °C | TM 2800 |
Storage period, without polymerization inhibitor, protected from light, 25°C | 3 | Months |
Typical Properties of Pure Resin Casting Body
performances | numerical value | unit (of measure) | Test Methods |
---|---|---|---|
Tensile strength¹ | 65 | MPa | ISO 527-2 |
Tensile modulus¹ | 3.3 | GPa | ISO 527-2 |
Tensile elongation at break¹ | 2.7 | % | ISO 527-2 |
Bending strength¹ | 115 | MPa | ISO 178 |
Bending modulus¹ | 3.4 | GPa | ISO 178 |
Heat Distortion Temperature HDT¹ | 125 | °C | ISO 75 Ae |
Glass transition temperature Tg¹ | 150 | °C | ASTM D570 |
Unnotched impact strength¹ | 10 | kJ/m² | ISO 179 |
Post-curing conditions
Curing conditions: 24 hours at room temperature, 24 hours after 80°C.
Test conditions: Temperature 23±2°C, Relative humidity 50±5%
SMC initial paste recommended formula
ingredient | numerical value |
---|---|
Palapreg® P 171-909 | 60 |
Palapreg® H 892-02 | 40 |
TBPB | 1.5 |
Zinc stearate | 4.5 |
calcium bicarbonate Ca(HCO3)2 | 180 |
MgO paste (35% content) | 3 |
Process Operation Guide
Palapreg® P 171-909 is usually used in combination with Palapreg® H 892-02 for the production of low shrinkage products. The ratio of Palapreg® P 171-909 to Palapreg® H 892-02 is normally 6040, but can be adjusted according to actual conditions. Depending on the dimensional requirements of the final product, 300ppm to 600ppm p-benzoquinone can be added to the formulation (based on the total amount of resin and low-shrinkage additives).