AOC PALAPREG® P 17-02 Low Bump Float SMC/BMC Molding Resin

Chemical/Physical Properties

Palapreg® P 17-02 is an unsaturated polyester resin derived from phthalic acid and standard ethylene glycol, dissolved in styrene. Palapreg® P 17-02 has medium viscosity and high reactivity.

major application

Palapreg P 17-02 is used in the production of SMC and BMC. It is mainly used with Palapreg polymer components for SMC/BMC applications with low shrinkage or low relief. The resin is easily thickened by magnesium oxide.

Product specifications at the time of delivery

causalityrealmunit (of measure)Test Methods
Viscosity, 23°C1,300 – 1,500mPa.s2013
Chromaticity, APHA0–140-2017
Solid content, IR63 - 66%2033
exterior conditionopen (non-secretive)-2265
water content0.04 – 0.07%2350
Acid value (so)15–19mg KOH/g2401
stickiness450000 - 900000mPa.s2914A
Gel time, 130°C65–110unit of angle or arc equivalent one sixtieth of a degree2261
peak time110–155unit of angle or arc equivalent one sixtieth of a degree2261
peak temperature265–290°C2261
Remarks:
Viscosity: Z2/100/23°C
Reactivity: Determined by adding 1 gram of TBPB to 100 grams of resin.
Typical Values Refractive Index (23°C - TM 2150) = 1.523 - 1.527

Properties of liquid resins (typical values)

causalitynumerical valueunit (of measure)TM
Density, 20°C1100kg/m³2160
flash point33°C2800
Stability, Not Started, Dark, 25°C3months-

Properties of unfilled resins (typical values)

causalitynumerical valueunit (of measure)TM
Density, 20°C1200kg/m³DIN 53479
bending strength100MPaISO 178
bending modulus3.8GPaISO 178
Outer fiber strain2.8%ISO 178
tensile strength60MPaISO 527-2
Tensile modulus of elasticity3.8GPaISO 527-2
Elongation at break1.7%ISO 527-2
Impact strength - unnotched specimen8kJ/m²ISO 179
Heat Deflection Temperature (HDT)140°CISO 75-A
Glass transition temperature (Tg)170°CISO 537

Properties of SMC molded parts (typical values)

causalitynumerical valueunit (of measure)TM
Glass content30%-
Density, 20°C1700kg/m³DIN 53479
bending strength200MPaISO 178
bending modulus13GPaISO 178
Outer fiber strain2.7%ISO 178
tensile strength100MPaISO 527-2
Tensile modulus of elasticity11GPaISO 527-2
Elongation at break1.9%ISO 527-2
Impact strength - unnotched specimen110kJ/m²ISO 179
Molding shrinkage0.25%DIN 53464
Glass transition temperature (Tg)200°CDIN 53445
Coefficient of linear thermal expansion (0-60°C)23-10-⁶K-¹DIN 53752/A
bulk resistivity10¹⁴Α-cmDIN 53482
surface resistance10¹²ΑDIN 53482
Comparative Leakage IndexCTI 600-DIN IEC 112

Properties of SMC molded parts (typical values)

ingredientweights
Palapreg® P 17-02100
TBpB1.5
Styrene5
Polyethylene powder5
Calcium carbonate150
Zinc stearate4
MgO-paste (35% MgO content) (MgO-paste (35% MgO))3

Processing:

Palapreg® P 17-02 is typically used for standard SMC/BMC or with Palapreg® polymer solution for low shrinkage/low bulge SMC and BMC.Typically, the ratio of Palapreg® P 17-02 to polymer solution is 60:40, but this can be adjusted if necessary.
Depending on the size of the molded part, it is recommended that 300 to 600 ppm of para-benzoquinone (calculated on the basis of epoxy resin plus thermoplastic solution) be added to the system.

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