LOCTITE® ECCOBOND NCP 5209适用于倒装芯片与层压板的热压粘合工艺。LOCTITE ECCOBOND NCP 5209是一种非导电的膏状粘合剂，专为先进的倒装芯片铜柱应用而设计。为初步确认关键，并提供塑化活性，以帮助焊点形成并达到倒装芯片粘接工艺的防震保护可靠性。
汉高 乐泰 Henkel LOCTITE® ECCOBOND NCP 5209
我们提供产品的中国销售（遵守互联网销售危化品管理规定）及部分产品的全球出口服务，并提供包括危化品包装、《出境货物包装性能检验证明》、《商检单》等相关出口手续。
我们有5.2类危险品，包括冷链产品的出口经验，曾出口美国，俄罗斯，土耳其，印度，乌克兰等国家。
We provide domestic sales and global export services for the above products, Including the Hazardous Chemical Packaging , "Inspection Certificate for Packing Functions of Outbound Goods" and "commodity inspection form"and other related exports manually.
We have experience in exporting 5.2 dangerous goods, including cold chain products, and have exported to the United States, Russia, Turkey, India, Ukraine and other countries.